Heatsink Compound Thermal Paste Silver
High Thermal Conductivity Low Bleed Stable
Uses: Thermal Coupling of Electrical Device to Heatsinks
Thermal Conductivity: >1.93 W/m-k
Thermal Impedance: <0.120°C-in²/W
For CPU Cooler Use
N. W. 1.0 Gram
Camera | Carrying Case | Computer Case | CPU | Fan | Hard Drive / Storage | Headset & Mic | I/O Controllers | Keyboard & MouseLaptop AC Adapter | Memory | Monitor | Motherboard | Networking | PC: Off-Lease | Power Supply | Speakers | Video Card
By continuing use this site, you agree to the Terms & Conditions